OPTIMIZATION OF INFRA-RED HEATING PARAMETERS FOR INSTALLATION OF ELECTRONIC COMPONENTS
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Abstract
Application of modern electronic components in micro miniature execution considerably raises density of assembly connections in electronic modules at installation of components on printed-circuit boards that forces to apply contactless methods of the heating, capable to raise quality of connections and to eliminate an overheat of components. Local heating by infra-red radiation allows to dose out precisely enough energy of heating to a zone of the soldering under condition of optimization of its parameters. By simulation of parameters of infra-red heating in SolidWorks efficiency of application of the quartz concentrator which reduces losses of radiated energy is shown and promotes its concentration in a zone of installation of electronic components on printed circuit board.
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References
Wassink, K.R. J. Soldering in Electronics / K.R.J. Wassink. – Ayr, Scotland.Electrochem.Publ. 2002. – 285 p.
Джюд, М., Пайка при сборке электронных модулей / М. Джюд, К. Бридли; пер. с англ. – М.: Издат. Дом «Технологии», 2006. – 416 с.
Ланин, В.Л. Электромонтажные соединения в электронике. Технология, оборудование, контроль качества / В.Л. Ланин, В.А. Емельянов. – Минск: Интегралполиграф, 2013. – 406 с.
Ланин, В.Л. Инфракрасный нагрев в технологии пайки изделий электроники / В.Л. Ланин // Электронная обработка материалов. – 2007. – № 5. – С. 91 – 96.
Патанкар, С.В. Численное решение задач теплопроводности и конвективного теплообмена при течении в каналах / С.В. Патанкар; пер. с англ. – М.: Изд-во МЭИ, 2003. – 312 с.
SolidWorks 2007-2008. Компьютерное моделирование в инженерной практике / А.А. Алямовский [и др.]. – СПб.: БХВ-Петербург, 2008. – 1040 с.
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