KMP E3502 NEGATIVE PHOTORESIST FILMS ON SILICON
Article Sidebar
Main Article Content
Abstract
Films of KMP E3502 negative photoresists with a thickness of 2.6–6.0 μm, deposited onto the surface of silicon wafers by centrifugation, were studied using the indentation method. Stabilizing treatment leads to uniform and homogeneous removal of residual solvent from the film. At the same time, the film becomes denser, which increases its strength and decreases its elastic-plastic properties; no significant change in the film homogeneity is observed. Also, the stabilizing treatment improves the adhesion of the KMP E3502 photoresist to the silicon substrate and leads to an increase in the microhardness values by ~ 1.5 times. After ion etching, a sharp increase in the heterogeneity of the photoresist film and strong structuring of the film surface are observed, with the appearance of a continuous array of irregularities with dimensions of ~ 10 μm. The microhardness values after ion etching increase by 2.2 times compared to the initial film, while an explosive increase (more than 200 times) in the dispersion of the distribution of microhardness values is observed. In ion-etched films, the distribution of microhardness values broadens significantly and deviates radically from Gaussian. This is due to the explosive nature of the evaporation of residual photoresist molecules, leading to "swelling" of the photoresist film.
Article Details

This work is licensed under a Creative Commons Attribution 4.0 International License.
D. BRINKEVICH, Belarusian State University, Minsk
канд. физ.-мат. наук
V. PROSOLOVICH, Belarusian State University, Minsk
канд. физ.-мат. наук, доц.
S. VABISHCHEVICH, Euphrosyne Polotskaya State University of Polotsk
канд. физ.-мат. наук, доц.
References
Наноматериалы и нанотехнологии / Под ред. В. Е. Борисенко, Н. К. Толочко – Мн.: Изд. центр БГУ, 2008. – С. 109–110.
Прочностные свойства фоторезистов для взрывной литографии / С. А. Вабищевич, Н. В. Вабищевич, Д. И. Бринкевич и др. // Вестник Полоцкого государственного университета. Серия С, Фундаментальные науки. – 2022. – № 4. – C. 49–55. – DOI: 10.52928/2070-1624-2022-38-4-49-55.
Индентирование пленок негативных фоторезистов для обратной литографии / С. А. Вабищевич, Д. И. Бринкевич, В. С. Просолович и др. // Вестник Полоцкого государственного университета. Серия С, Фундаментальные науки. – 2025. – № 1(44). – C. 53–60. – DOI: 10.52928/2070-1624-2025-44-1-53-60.
Модификация спектров отражения пленок диазохинон-новолачного фоторезиста при имплантации ионами бора и фосфора / Д. И. Бринкевич, А. А. Харченко, В. С. Просолович и др. // Микроэлектроника – 2019. – Т. 48, № 3. – С. 235–239. – DOI: 10.1134/S0544126919020029.
Stabilizing Treatment of Negative Photoresist Films of the AZ nLOF20XX Series on Silicon / V. S. Prosolovich, D. I. Brinkevich, E. V. Grinyuk et al. // Russian Microelectronics. – 2025. – Vol. 54, iss. 6. – Р. 589–594. – DOI: 10.1134/S106373972560089X.
Adhesion of Irradiated Diazoquinone-Novolac Photoresist Films to Single-Crystal Silicon / S. A. Vabishchevich, S. D. Brinkevich, N. V. Vabishchevich et al. // High Energy Chemistry. – 2021. – Vol. 55, iss. 6 – P. 495–501. – DOI: 10.1134/S0018143921060151.
Лапшинов Б. А. Технология литографических процессов: учеб. пособие. – М.: МИЭМ, 2011. – 95 с.
Влияние фоновых примесей на формирование дефектов упаковки в пластинах кремния / Д. И. Бринкевич, В. С. Просолович, С. А. Вабищевич, А. Н. Петлицкий // Микроэлектроника. – 2006. – Т. 35, № 2. – С. 112–116.
Прочностные свойства нейтронно-облученных эпитаксиальных пленок CdTe / А. Т. Акобирова, С. А. Вабищевич, Н. В. Вабищевич и др. // Журнал БГУ. Физика. – 2018. – № 1. – С.73–79.
Пленки фоторезистов серии AZ nLOF на монокристаллическом кремнии / Д. И. Бринкевич, Е. В. Гринюк, В. С. Просолович и др. // Микроэлектроника. – 2025. – Т. 54, № 1. – С. 55–63. – DOI: 10.31857/S0544126925010068.
Transformation of the Spectra of a Attenuated Total Reflection when Drying a Diazoquinone-Novolach Photoresist / D. I. Brinkevich, S. D. Brinkevich, A. N. Petlitsky, V. S. Prosolovich // Russian Microelectronics. – 2021. – Vol. 50, iss. 4. – Р. 239–245. – DOI: 10.1134/S106373972104003X.
Fourier-IR spectroscopy of photoresist/silicon structures for explosive lithography / D. I. Brinkevich, E. V. Grinyuk, S. D. Brinkevich et al. // Journal of Applied Spectroscopy. – 2024. – Vol. 90, iss. 6, – P. 1223–1228. – DOI: 10.1007/s10812-024-01657-4.
Пленки негативного фоторезиста AZ nLOF 5510, облученные электронами / С. А. Абрамов, Д. И. Бринкевич, В. С. Просолович и др. // Вестник Полоцкого государственного университета. Серия С, Фундаментальные науки. – 2025. – № 1(44). – C. 39–46. – DOI: https://doi.org/10.52928/2070-1624-2025-44-1-39-46.
Most read articles by the same author(s)
- S. VABISHCHEVICH, N. VABISHCHEVICH, D. BRINKEVICH, V. PROSOLOVICH, FILMS OF POSITIVE DIAZOQUINONE-NOVOLAC PHOTORESIST FP9120 IMPLANTED WITH SILVER IONS, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 2 (2023)
- S. VABISHCHEVICH, Н. В. ВАБИЩЕВИЧ, G.A. ESPINOZA de los MONTEROS, D. BRINKEVICH, V. PROSOLOVICH, RADIATION-INDUCED PROCESSES IN FILMS OF DIAZOQUINONE-NOVOLAC RESIST ON SILICON DURING IMPLANTATION OF Ag+ IONS, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 4 (2020)
- A. VASUKOV, S. VABISHCHEVICH, N. SUKHOVILO, N. VABISHCHEVICH, RESEARCH OF SURFACE OF ASPHALTENES BY ATOMIC-POWER MICROSCOPY, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 4 (2020)
- S. VABISHCHEVICH, N. VABISHCHEVICH, D. BRINKEVICH, V. PROSOLOVICH, V. KOLOS, O. ZUBOVA, STRENGTH PROPERTIES OF ELECTRON IRRADIATED FILMS OF NEGATIVE NOVOLAC PHOTORESISTS ON MONOCRYSTALLINE SILICON, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 2 (2023)
- D. BRINKEVICH, С. Д. БРИНКЕВИЧ, S. VABISHCHEVICH, V. KROT, A. MALIBORSKI, LONG-LIVING β-RADIATING RADIONUCLIDES IN THE MANUFACTURE OF RADIOPHARMATIC DRUGS BASED ON 18F, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 4 (2019)
- D. BRINKEVICH, M. LUKASHEVICH, V. PROSOLOVICH, A. KHARCHENKO, S. VABISHCHEVICH, N. VABISHCHEVICH, MICROHARDNESS OF POLYIMIDE AND POLYETHYLENE TEREPHTHALATE FILMS IRRADIATED WITH 60Co GAMMA QUANTA, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 12 (2017)
- V. GOLOVCHUK, A. KHARCHENKO, D. BRINKEVICH, M. LUKASHEVICH, S. VABISHCHEVICH, N. VABISHCHEVICH, STRUCTURAL AND OPTICAL CHARACTERISTICS OF CARBON-CONTAINING SILICATE GLASS IMPLANTED BY COPPER IONS, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 12 (2017)
- S. VABISHCHEVICH, D. BRINKEVICH, V. PROSOLOVICH, S. BRINKEVICH, O. ZUBOVA, N. VABISHCHEVICH, PHYSICO-MECHANICAL PROPERTIES OF KMP E3502 NEGATIVE PHOTORESIST FILMS ON SILICON, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 2 (2025)
- S. VABISHCHEVICH, N. VABISHCHEVICH, D. BRINKEVICH, RADIATION-INDUCED PROCESSES IN PYROLITIC GRAPHITE FILMS USED IN THE COMMERCIAL CYCLOTRON BEAM OUTPUT SYSTEM, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 12 (2019)
- D. BRINKEVICH, S. VABISHCHEVICH, V. PROSOLOVICH, Y. YANKOVSKI, MODIFICATION OF THE SURFACE LAYERS OF SILICON SINGLE CRYSTALS IMPLANTED WITH B+ AND P+ IONS AT THE CREATION OF SEMICONDUCTOR DEVICES BY CMOS TECHNOLOGY, Vestnik of Polotsk State University. Part C. Fundamental Sciences: No. 4 (2015)