PHYSICO-MECHANICAL PROPERTIES OF KMP E3502 NEGATIVE PHOTORESIST FILMS ON SILICON
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Abstract
Films of negative photoresists (FR) KMP E3502 with a thickness of 2,6–5,8 microns deposited on the surface of silicon wafers by centrifugation have been studied by the indentation method. It was experimentally established that the strength and adhesive properties of the KMP E3502 films are close to the similar properties of the AZ nLOF 20XX series. The fracture toughness coefficient K1C films of the КМР E3502 increases with an increase in the load. Neither additional strengthening nor ion etching had a significant impact on their crack resistance. Adhesis (specific energy of peeling G) of thin films is 3 times lower compared to thick films of the КМР E3502. The values of G thick КМР E3502 film are close to the size G of the initial film AZ nLOF2070. Additional strength-ening and ionic etching did not have a significant impact on the adhesion of the photoresistic film of the КМР E3502 to silicon substrate. The true microhardness of КМР E3502 thin films was 0,3 GPa and was ~ 2 times higher than the microhardness of similar functional AZ nLOF5510 films. After stabilizing processing and ion etching, it increased, which is due to the sewing of the photoresist molecules. In thick films of КМР E3502, the microhardness increased with distance from the film surface and stabilized at ~ 0.55 GPa as it approached the photoresist/silicon interface. This behavior of microhardness is due to uneven heating of the film during drying during its formation, since heating was carried out from the substrate. The obtained experimental data are explained taking into account the ordering of the photoresist film structure near the PR/silicon interface due to the orientation of molecules and conformational changes in the structure of the main component of the photoresist – phenol-formaldehyde resin. Radiation-stimulated processes occurring during etching of CMR E3502 films with Ar ions are caused by the formation of covalent crosslinking between polymer molecules, which contribute to the hardening of the film.
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References
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