STUDY OF STRENGTH PROPERTIES OF PHOTORESIST FILMS ON SILICON BY THE SCRATCHING METHOD

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S. VABISHCHEVICH
N. VABISHCHEVICH
D. BRINKEVICH
V. PROSOLOVICH
Y. YANKOVSKI

Abstract

The strength properties of the structures of the photoresist-silicon was investigated by indenting and scratching methods. Film positive photoresist with thickness of 1.0–5.0 μm was deposited on silicon wafers of various brands by the centrifugation method. It was found that the microhardness as determined by sclerometer, 20–40 % more than microhardness obtained by the microindentation methods. When using the load, which equals 1–2 g, more accurate values of microhardness gives the scratching method. Increasing the load to 10 or more grams leads to a leveling of the specified differences – values of microhardness obtained by both methods coincide.

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How to Cite
VABISHCHEVICH, S., VABISHCHEVICH, N., BRINKEVICH, D., PROSOLOVICH, V., & YANKOVSKI, Y. (2015). STUDY OF STRENGTH PROPERTIES OF PHOTORESIST FILMS ON SILICON BY THE SCRATCHING METHOD. Vestnik of Polotsk State University. Part C. Fundamental Sciences, (12), 67-71. Retrieved from https://journals.psu.by/fundamental/article/view/5628
Author Biographies

S. VABISHCHEVICH, Polotsk State University

канд. физ.-мат. наук, доц.

D. BRINKEVICH, Belarusian State University, Minsk

канд. физ.-мат. наук

V. PROSOLOVICH, Belarusian State University, Minsk

канд. физ.-мат. наук, доц.

Y. YANKOVSKI, Polotsk State University

канд. физ.-мат. наук

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